Qcn7606 Firmware Security Vulnerabilities - 2020

CVE-2019-10527

u'SMEM partition can be manipulated in case of any compromise on HLOS, thus resulting in access to memory outside of SMEM address range which could lead to memory corruption' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Co...

CVE-2019-14037

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice &...

CVE-2020-11154

u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon...

CVE-2020-11155

u'Buffer overflow while processing PDU packet in bluetooth due to lack of check of buffer length before copying into it.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mob...

CVE-2020-11169

u'Buffer over-read while processing received L2CAP packet due to lack of integer overflow check' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & M...